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IPhone 6S - Botched Audio IC Replacement
I replaced an audio IC speaker amplifier, u3700, which was shorted. Came out with no problem. When I was installing the new one and heating it, I nudged it to make sure it was in place (big mistake). Well, it was in place, but by doing so, I knocked a couple of components. When I tried moving them back, my shaky hands made it worse. I pushed some components under the shield as you can see in the pictures from 3 different angles. I should have not touched it and let it just seat itself!
I'm thinking the only way I could fix this now is by removing the shield; as I will have full access to the components. Is this a good idea? Is it too risky? How should I proceed? Any ideas?
I have decades of experience troubleshooting and repairing electronics, but working with these incredibly small parts is all new to me.
yeah, just cut away the shield but be careful because i think the eeprom may be under there. No need to use heat though.
@admin I thought you'd get back to me that day, but since you didn't and I didn't have time to wait, I went ahead and removed the shield using 360C, low airflow, tracing the frame of the bracket for 1 -2 minutes while slowing lifting the corner. Everything went well. Phone is working.
I just want to know though; is it not worth the risk removing it with heat? Is it better to just cut away? I'm always concerned about overheating components and that's where all the RF components are located, so I'm usually very cautious. Doing it this way does yield a better looking result though.
If i want to remove the entire shield all the way around, then I'll use heat. Otherwise, I'll just cut it out with my wire cutter. Either way is fine. Sometimes cutting it leaves metal poking upwards and into the charge port, so be mindful of that. And sometimes using heat will cause other components to shift.