Product description
This low melt solder paste is great for the top layer of the middle connector board on the iPhone X/Xs/Xs Max. It has a melting point of 138°C.
This low melt solder paste is great for the top layer of the middle connector board on the iPhone X/Xs/Xs Max. It has a melting point of 138°C.
Weight | .09 lbs |
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Dimensions | 4 × .25 × .25 in |