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0.25mm Sn63/Pb37 BGA Solder Balls – 25,000 Units


Out of stock

Product description

0.25MM Sn63/Pb37 BGA Solder Balls.  These are great for reballing ICs where you need precision with the amount of solder on each pad.  Without using balls, you will often get bridging under the chip causing shorts.

Additional information

Weight .1 lbs
Dimensions 1 × 1 × .25 in