This is the stuff that we use. It melts at 138C. You won’t need it very often, so one vial of these and you should be set for a while. This stuff allows you to remove components and connectors without using the super high heat required to melt lead-free solder. Just dab a little bit of this stuff on the logic board, then use your soldering iron to mix the lead-free solder with the low melt solder paste, then use your microtweezers or your hot air rework station at around 225C to remove the connector/component.
Contains 42g of low melt solder paste!