This is a hybrid 3d/regular bga stencil, which I think is better than both. It’s better than the 3d stencil because it doesn’t tightly secure the chip under the stencil which sometimes causes stencil to bend upwards as the heat is applied to it. It’s better than the regular stencil because the holes are square and very thin, which reduces the amount of solder paste in each hole. These are the stencils that we will be using, ongoing. 0.12MM represents the thinness of the steel.